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KING BILLION ELECTRONICS CO., LTD
HE83115
HE80000 SERIES
A.HE83115 Introduction
HE83115 is a member of 8-bit Micro-controller series developed by King Billion Electronics Ltd. Users can chose any one of combination among 80 dots LCD Driver + 12 Bit I/O Port...48 dots LCD Driver + 20 Bit I/O Portetc. The built-in OP comparator can be used with (lightvoice temperaturehumility) sensor and used as battery low detection. And the 7-bit current-type D/A converter and PWM device provide the complete speech output mechanism. The 64K ROM Size can be used in the storage of speech (20 seconds at 3Kbytes per second), graphic, text etc. This IC is applicable to the small systems such as sport match, sport recorder, digital watch etc.. The instruction set of HE83115 are quite easy to learn and simple to use. Only about thirty instructions with four-type addressing mode are provided. Most of instructions take only 3 oscillator clocks (machine cycles). The processing power is enough to most of battery operation system.
B.HE83115 Features
2.4V - 5.5V DC ~ 8MHz @ 5.0V DC ~ 4MHz @ 2.4V Internal ROM 64K Bytes(64K Program ROM) Internal RAM 256 Bytes. Dual Clock System Normal (Fast) clock 32.768K ~ 8MHz Slow clock 32.768KHz Operation Mode DUALFASTSLOWIDLESLEEP Mode. With WDT (WATCH DOG TIMER) to prevent deadlock condition.. 12~20 bit Bi-directional I/O port. Mask Option can select PUSH-PULL or OPEN DRAIN output mode for each I/O pin. One built-in OP comparator. 80~48 dots LCD driver (AB TYPE selectable). One 7-bit current-type DAC output. PWM device. Two external interrupts and two internal timer interrupts. Two 16-bit timer. Instruction set 32 instructions, 4 addressing mode. 8-bit DATA POINTER for RAM and 16-bit TABLE POINTER for ROM. Operation Voltage System Clock
C.HE83115 Application
Please always take in mind that ICE is different from IC. ICE is the whole set of HE80000 series IC, but each IC is a subset of ICE. Never use any hardware resource that real IC didn't have, especially RAM and register. KBIDS and compiler cannot prevent user to use some hardware resource that didn't exist. Please check the following table and refer the abbreviation in HE80000 user's manual.
I.F.C. E.S.C. I.P.R PROM DROM TP TP+1 RAM 64KB -- 16-bit 256B VO DAO OP PWM LCD COM*SEG Bias Rgr -- 80~48 4*20 1/3 -- PP DP I/O DTMF WDT Timer -- 8-bit 12~20 -- T1,T2 ChrgPmp LV2 LR LVG REC S.R. 1,3/2,3 -- -- -- --
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KING BILLION ELECTRONICS CO., LTD
HE83115
HE80000 SERIES
D. Pin Description
Pin #
43 42
Pin name
FXI, FXO
I/O
B, O
Function
Description
External fast clock pin. Mask option setting Connecting to crystal or RC MO_FCK/SCKN= 00Slow Clock only to generate 32.768 kHz ~ 01Illegal 8MHz frequency. 10Dual Clock 11Fast Clock only MO_FOSCE = 0Internal fast osc. = 1External fast osc. MO_FXTAL= 0RC osc. for fast clock = 1X'tal osc. for fast clock MO_SXTAL= 0RC for 32768 Hz clock = 1X'tal for 32768 Hz clock Use OP1 and OP2 to switch among different operation mode (NORMAL, SLOW, IDEL and SLEEP). In Dual Clock mode, the main system clock is still the Fast Clock. The 32768 Hz clock is for LCD and Timer 1 only. Level trigger, active low. Except for using this pin, using mask option (MO_PORE=1) could enable IC build-in power-on reset circuit. Besides, MO_WDTE can set Watch Dog Timer MO_WDTE=0Disable Watch Dog Timer =1Enable Watch Dog Timer
46 45
SXI, SXO
I, O
External slow clock pin. Connecting with 32768 Hz crystal or resistor as slow clock and providing clock source for LCD display, TIMER1, Time-Base and other internal blocks.
41
RSTP_N
I
System Reset.
44
TSTP_P
I
Test Pin
Please bond this pin and add a test point on PCB for debugging. Leave this pin floating is OK.
Mask options MO_CPP[3..0]=1 ~ Push-pull. =0 ~ Open-drain. Output must be "1" before reading whenever use them as input (No tri-state structure). Mask options MO_DPP[7..0]=1 ~ Push-pull. =0 ~ Open-drain. Output must be "1" before reading whenever use them as input (No tri-state structure). Mask options MO_LIO14[7..0]=1 ~ LCD Pin. =0 ~ I/O Pin. MO_14PP[7..0]=1 ~ Push-pull. =0 ~ Open-drain. Output must be "1" before reading whenever use them as input (No tri-state structure). LCD Data filled from F0H, please refer the LCD RAM map. Add one 0.1 F capacitor between LC1 and LC2. Please refer the application circuit. LV3< 9 Volts.
1..4
PRTC[3:0]
B
4-pin bi-directional I/O port.
48.. 55
PRTD[7:0]
B
8-pin bi-directional I/O port. PRTD[7..2] as wake-up pin. PRTD[7..6] as external interrupt pin.
7..14
PRT14[7:0]/ B/ SEG[19:12] O
8-pin bi-directional I/O port that is shared with LCD segment pin.
27.. 30 15.. 26 32 31 35
COM[3:0] SEG[11:0] LC2 LC1 LV3
O O B B B
LCD COMmon Output LCD SEGment Output Charge Pump Switch 2 Charge Pump Switch 1 Charge Pump V3
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KING BILLION ELECTRONICS CO., LTD
HE83115
HE80000 SERIES
Pin #
34 33 5
Pin name
LV2 LV1 PWMP
I/O
B B O
Function
Description
Please refer the application circuit.
6 37 38 39 40 47 36
PWMN VO OPIN OPIP OPO VDD GND
O O I I O P P
Charge Pump V2 Charge Pump V1 The PWM positive output can drive speaker or buzzer Set the bit2 of VOC register as one to turn on PWM. directly. The PWM positive output can drive speaker or buzzer Set the bit2 of VOC register as one to turn on PWM. directly. D/A output. Bit 1 of VOC = `1' , Turn on DA OPAMP negative input pin. Built-in OP comparator. OPAMP positive input pin. Set Bit 0 of VOC = `1' , Turn on OP OPAMP output pin. Positive Power Input Adding 0.1 F capacitor as by-pass capacitor on power pins is necessary.(within 1 cm distance) Power Ground Input
E. LCD RAM Map
Page 0: F0H F1H F2H F3H F4H SEG1 COM[3:0] SEG3 COM[3:0] SEG5 COM[3:0] SEG7 COM[3:0] SEG9 COM[3:0] SEG0 COM[3:0] SEG2 COM[3:0] SEG4 COM[3:0] SEG6 COM[3:0] SEG8 COM[3:0] F5H F6H F7H F8H F9H SEG11 COM[3:0] SEG13 COM[3:0] SEG15 COM[3:0] SEG17 COM[3:0] SEG19 COM[3:0] SEG10 COM[3:0] SEG12 COM[3:0] SEG14 COM[3:0] SEG16 COM[3:0] SEG18 COM[3:0]
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KING BILLION ELECTRONICS CO., LTD
HE83115
HE80000 SERIES
F.
Pin Diagram
P PPPPPPRPPPPP RRRRRRTRRRRR TTTTTTDTTTTTVSS C C C C D D [2] D D D D D D X X [0] [1] [2] [3] [0] [1] [3] [4] [5] [6] [7] D I O
Product Name TSTP_P FXI FXO RSTP_N OPO OPIP OPIN VO GND LV3 LV2
PWMP PWMN PRT14[7]/SEG[19] PRT14[6]/SEG[18] PRT14[5]/SEG[17] PRT14[4]/SEG[16] PRT14[3]/SEG[15] PRT14[2]/SEG[14] PRT14[1]/SEG[13]
Die Size: A1: 2500 m * 2140 m A2: 2410 m * 2190 m Substrate connect with GND
P R T 1 4 [0] / S E G [1 2]
S E G [1 1]
S E G [1 0]
S S S S S S S S S S C C C C LLL E E E E E E E E E E O O O O CCV G G G G G G G G G G MMMM12 1 [9] [8] [7] [6] [5] [4] [3] [2] [1] [0] [3] [2] [1] [0]
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KING BILLION ELECTRONICS CO., LTD
HE83115
HE80000 SERIES
G. Bonding Pad Location
Which version of IC decided by KB when customer gives order to KB. Please make sure which version will be used before you make a PCB! Version A1: PIN PIN Number Name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 PRTC[3] PRTC[2] PRTC[1] PRTC[0] PWMP PWMN PRT14[7] PRT14[6] PRT14[5] PRT14[4] PRT14[3] PRT14[2] PRT14[1] PRT14[0] SEG[11] SEG[10] SEG[9] SEG[8] SEG[7] SEG[6] SEG[5] SEG[4] SEG[3] SEG[2] SEG[1] SEG[0] COM[3] COM[2]
X Coordinate X= -532.10 X= -647.60 X= -763.10 X= -878.60 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1115.20 X= -999.80 X= -884.20 X= -768.80 X= -653.20 X= -537.80 X= -422.20 X= -306.80 X= -191.20 X= -75.80 X= 39.80 X= 155.20 X= 270.80 X= 386.20 X=
Y Coordinate Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= 991.60 991.60 991.60 991.60 288.20 124.80 -14.30 -129.80 -245.30 -360.80 -476.20 -591.80 -707.20 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50
PIN Number 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
PIN Name COM[1] COM[0] LC1 LC2 LV1 LV2 LV3 GND VO OPIN OPIP OPO RSTP_N FXO FXI TSTP_P SXO SXI VDD PRTD[7] PRTD[6] PRTD[5] PRTD[4] PRTD[3] PRTD[2] PRTD[1] PRTD[0]
X Coordinate X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= 617.20 732.80 848.20 963.80 1079.20 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 738.40 622.90 507.40 391.90 276.40 160.80 45.40 -70.20 -185.70 -301.10 -416.60
Y Coordinate Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= -991.50 -991.50 -991.50 -991.50 -991.50 -702.80 -587.20 -471.80 -356.20 -240.80 -125.20 -9.80 105.80 221.20 336.80 452.20 991.60 991.60 991.60 991.60 991.60 991.60 991.60 991.60 991.60 991.60 991.60
501.80 Y=
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KING BILLION ELECTRONICS CO., LTD
HE83115
HE80000 SERIES
Version
A2: X Coordinate Y PIN PIN Coordinate Number Name 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 X Coordinate Y Coordinate
PIN PIN Number Name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
PRTC[3] X= -485.65 Y= 1024.20 PRTC[2] X= -601.75 Y= 1024.20 PRTC[1] X= -717.50 Y= 1024.20 PRTC[0] X= -833.50 Y= 1024.20 PWMP X= -1115.90 Y= 259.30 PWMN X= -1115.90 Y= 95.95 PRT14[7] X= -1115.75 Y= -47.85 PRT14[6] X= -1115.75 Y= -163.35 PRT14[5] X= -1115.75 Y= -279.70 PRT14[4] X= -1115.75 Y= -395.15 PRT14[3] X= -1115.75 Y= -510.65 PRT14[2] X= -1115.75 Y= -627.60 PRT14[1] X= -1115.75 Y= -743.10 PRT14[0] X= -1101.25 Y= -1009.00 SEG[11] X= -985.75 Y= -1009.00 SEG[10] X= -869.45 Y= -1009.00 SEG[9] X= -753.95 Y= -1009.00 SEG[8] X= -637.60 Y= -1009.00 SEG[7] X= -522.10 Y= -1009.00 SEG[6] X= -405.95 Y= -1009.00 SEG[5] X= -290.45 Y= -1009.00 SEG[4] X= -173.85 Y= -1009.00 SEG[3] X= -58.35 Y= -1009.00 SEG[2] X= 57.15 Y= -1009.00 SEG[1] X= 173.80 Y= -1009.00 SEG[0] X= 289.30 Y= -1009.00 COM[3] X= COM[2] X= 405.45 Y= -1009.00 520.95 Y= -1009.00
COM[1] X= COM[0] X= LC1 X= LC2 X= LV1 X= LV2 X= LV3 X= GND X= VO X= OPIN X= OPIP X= OPO X= RSTP_N X= FXO X= FXI X= TSTP_P X= SXO X= SXI X= VDD X= PRTD[7] X= PRTD[6] X= PRTD[5] X= PRTD[4] X= PRTD[3] X= PRTD[2] X= PRTD[1] X=
637.85 Y= -1009.00 753.35 Y= -1009.00 868.85 Y= -1009.00 985.35 Y= -1009.00 1100.85 Y= -1009.00 1135.70 Y= -717.30 1135.70 Y= -601.50 1135.70 Y= -486.00 1135.70 Y= -370.50 1135.70 Y= -254.00 1135.70 Y= -137.80 1135.70 Y= -21.90 1135.70 Y= 93.60 1135.70 Y= 209.95 1135.70 Y= 325.45 1135.70 Y= 440.95 789.00 Y= 1024.20 673.20 Y= 1024.00 558.00 Y= 1024.20 441.80 Y= 1023.80 325.75 Y= 1023.90 209.75 Y= 1023.85 94.00 Y= 1023.90 -22.00 Y= 1024.20 -138.05 Y= 1024.20 -253.95 Y= 1024.20
PRTD[0] X= -369.70 Y= 1024.20
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KING BILLION ELECTRONICS CO., LTD
HE83115
HE80000 SERIES
H. DC/AC Characteristics
Absolute Maximum Rating
Item Supply Voltage Input Voltage Output Voltage Operating Temperature Storage Temperature
Sym. Rating Vdd -0.5V ~ 8V Vin -0.5V ~ Vdd+0.5V Vo -0.5V ~ Vdd+0.5V Top 00C ~ 700C Tst -500C ~ 1000C
Condition
Recommended Operating Conditions
Item Supply Voltage Input Voltage Operating Frequency Operating Temperature Storage Temperature
Rating 2.4V ~ 5.5V 0.9 Vdd ~ Vdd 0.0V ~ 0.1Vdd 8MHz Fmax 4MHz Top 00C ~ 700C Tst -500C ~ 1000C
Sym. Vdd Vih Vil
Condition
Vdd =5.0V Vdd =2.4V
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KING BILLION ELECTRONICS CO., LTD
HE83115
HE80000 SERIES
Testing Condition : TEMP=25, VDD=3V+/-10%, GND=0V IFast ISlow IIdle PARAMETER NORMAL Mode Current System SLOW Mode Current IDLE Mode Current System System CONDITION 2M ext. R/C 32.768K X'tal LCD Disable 32.769K X'tal LCD Disable LCD Enable VDD=3V; Voh=2V VDD=3V; VoL=1V MIN TYP MAX UNIT 0.75 1 mA 6 4 2 12 33 15 40 3 9 7 3 1 A A A A mA mA mA V 0.2 VDD Threshold=2/3VDD(input from low to high) Threshold=1/3VDD(input from high to low) VoL=2.0V VoL=0.4V ViL=GND, pull high Internally ViL=GND, if pull high Internally by user 1/3 VDD 50 1.0 20 100 V
ILCD Extra Current if LCD ON System System ISleep Sleep Mode Current IoHPWM PWM Output Drive Current PWMP, PWMN*2 IoLPWM PWM Output Sink Current PWMP, PWMN*2 VO IoVO DAC Output Current ViH ViL Input High Voltage Input Low Voltage I/O pins I/O pins
VDD=3V;VO=0~2V,Data=7F 2.5 0.8 VDD
Vhys IoH IoL_1 IiL_1 IiL_2
Input Hysteresis Width Output Drive Current Output Sink Current Input Low Current Input Low Current Note:
I/O, RSTP_N I/O pull-high*1 I/O pull-low*1 RSTP_N I/O
V A mA A A
*1: Drive Current Spec. for Push-Pull I/O port only Sink Current Spec. for both Push-Pull and Open-Drain I/O port. *2: This Spec. base on one driver only. There are five build-in driver, so user just multiply the number of driver he used to one driver current to get the total amount of current. ( IoHPWMIoLPWM * N; N=0,1,2,3,4,5)
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KING BILLION ELECTRONICS CO., LTD
HE83115
HE80000 SERIES
I. Application Circuit
Tripple Charge Pump is selected Tripple Charge Pump is selected Tripple Charge Pump is selected LCD Max. Voltage=LV3=3*VDD LCD Max. Voltage=LV3=3/2*VDD LCD Max. Voltage=LV3=VDD VDD LV1 LC1 C4 0.1uF LC2 0.1uF LC2 C4 0.1uF LC2 VDD LV2 LC1 C4 VDD LV3 LC1
VDD VDD R1 50K BATTERY 1 C1 C2 RSTP_N C3 0.1uF SW1 RESET GND LC1 LC2 C5 0.1uF C6 0.1uF C7 0.1uF LC1 LC2 LV1 LV2 LV3 < 9 Volt OPIN OPIP OPO COM[3:0] SEG[11:0] PRT14[7:0]/SEG[19:12] SXO PRTD[7:0] PRTC[3:0] FXI FXO SXI FXI FXO SXI SXO
No External Parts is necessary if user adopt Internal Fast RC Clock External Fast Clock: Crystal osc.
FXI 2MHZ FXO 20P 20P
3V
0.1uF 100uF
LCD PANEL
External Fast Clock: RC osc.
VDD
R > 8.2 KOhm FXI C: Please Ref . AN016
PWMP PWMN
Buzzer or Speaker Circuit Passive Bias & Filter Circuit
VDD SP1
External Slow Clock: Crystal osc.
SXI 20P 32.768K SXO 20P
VO TSTP_P
Q1 NPN
SPEAKER
HE83115
Please Refer AN022 for Speech Output Circuit
External Slow Clock: RC osc.
SXI R: Please ref . AN016 SXO
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V3.3E
KING BILLION ELECTRONICS CO., LTD
HE83115
HE80000 SERIES
J. Important Note
1. LCD driving circuit must be turn off before IC goes into sleep mode. 2. Please bonds the TSTP_P, RSTP_N and PRTD[7:0] with test point on PCB (can be soldered and probed) as you can, then KB can do some IC testing job on PCB. Neither VDD nor GND connection is necessary for TSTP_P. The following figure is an example (Testing point with through hole).
K. Updated Record
Version V3.3 Date Nov 28, 2001 Section Original Content B, H 2.2V (VDD operation voltage) J, K New Section New Content 2.4V
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